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Ingeniería Electrónica, Automática y Comunicaciones
versión On-line ISSN 1815-5928
Resumen
F. QUINTEROS, Nicolás y M. ESPINOZA, Víctor. Electroacoustic and thermal analysis of an overhung-type moving-coil loudspeaker using LTspice. EAC [online]. 2022, vol.43, n.3, pp. 29-44. Epub 14-Feb-2022. ISSN 1815-5928.
This research presents an extension of the SPICE loudspeaker work done by Leach for an overhung-type moving-coil dynamic loudspeaker, where the height of the voice coil is greater than the magnetic gap's height. Using LTspice software, which simulates SPICE, the complete equivalent electrical, mechanical, and acoustic models from the electroacoustic analogies were developed, which allowed verifying the original equivalent model. Sub-circuits were then developed, allowing direct measurement of the velocity and volume velocity emitted by the diaphragm in the complete equivalent mechanical circuit. In addition, three models of electrical inductance and three models of radiation acoustic impedance were implemented. Furthermore, the thermal linear model of the loudspeaker and the resistance model with temperature variation of the voice coil were implemented. The results of the models showed consistency in the measured and simulated responses of the loudspeaker used. The different electrical inductance and radiation acoustic impedance models showed their use and implementation advantages and disadvantages. The thermal linear model showed a reasonable estimation of the measured temperature in the loudspeaker, except for the cooling of the voice coil. Finally, the results of the implementation of the thermal model on the electrical resistance of the loudspeaker showed the expected behavior as indicated in the literature, i.e., increasing the temperature increases the magnitude of the input electrical impedance, decreases the displacement and velocity of the diaphragm and decreases the sound pressure level.
Palabras clave : Loudspeakers; Temperature Effect; Electrical Impedance; Frequency-response; SPICE Model; SPICE Simulation.