<?xml version="1.0" encoding="ISO-8859-1"?><article xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">
<front>
<journal-meta>
<journal-id>1815-5928</journal-id>
<journal-title><![CDATA[Ingeniería Electrónica, Automática y Comunicaciones]]></journal-title>
<abbrev-journal-title><![CDATA[EAC]]></abbrev-journal-title>
<issn>1815-5928</issn>
<publisher>
<publisher-name><![CDATA[Universidad Tecnológica de La Habana José Antonio Echeverría, Cujae]]></publisher-name>
</publisher>
</journal-meta>
<article-meta>
<article-id>S1815-59282024000200001</article-id>
<title-group>
<article-title xml:lang="es"><![CDATA[Análisis térmico basado en simulación asistida por computadora del circuito impreso de una fuente de alimentación]]></article-title>
<article-title xml:lang="en"><![CDATA[Thermal analysis based on computer assisted simulation of the printed circuit board of a power supply.]]></article-title>
</title-group>
<contrib-group>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Siles Siles]]></surname>
<given-names><![CDATA[Irina B.]]></given-names>
</name>
<xref ref-type="aff" rid="Aff"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Prendes]]></surname>
<given-names><![CDATA[Lázaro G. Cordero]]></given-names>
</name>
<xref ref-type="aff" rid="Aff"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Reyes]]></surname>
<given-names><![CDATA[Miguel A. Mendoza]]></given-names>
</name>
<xref ref-type="aff" rid="Aff"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Prieto]]></surname>
<given-names><![CDATA[Carlos A. Bazán]]></given-names>
</name>
<xref ref-type="aff" rid="Aff"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Laguardia]]></surname>
<given-names><![CDATA[Alain S. Martínez]]></given-names>
</name>
<xref ref-type="aff" rid="Aff"/>
</contrib>
</contrib-group>
<aff id="Af1">
<institution><![CDATA[,Universidad Central &#8220;Marta Abreu&#8221; de Las Villas  ]]></institution>
<addr-line><![CDATA[ ]]></addr-line>
<country>Cuba</country>
</aff>
<pub-date pub-type="pub">
<day>00</day>
<month>08</month>
<year>2024</year>
</pub-date>
<pub-date pub-type="epub">
<day>00</day>
<month>08</month>
<year>2024</year>
</pub-date>
<volume>45</volume>
<numero>2</numero>
<fpage>1</fpage>
<lpage>12</lpage>
<copyright-statement/>
<copyright-year/>
<self-uri xlink:href="http://scielo.sld.cu/scielo.php?script=sci_arttext&amp;pid=S1815-59282024000200001&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://scielo.sld.cu/scielo.php?script=sci_abstract&amp;pid=S1815-59282024000200001&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://scielo.sld.cu/scielo.php?script=sci_pdf&amp;pid=S1815-59282024000200001&amp;lng=en&amp;nrm=iso"></self-uri><abstract abstract-type="short" xml:lang="es"><p><![CDATA[RESUMEN El sobrecalentamiento de la placa de circuito impreso (Printed Circuit Board, PCB) es un problema que puede estar presente en la sección de la fuente de alimentación de los equipos electrónicos. Debido al impacto negativo que este problema puede tener en el rendimiento y la confiabilidad del dispositivo, debe recibir atención especial desde las primeras etapas del diseño del sistema. El uso de herramientas de automatización de diseño electrónico (Electronic Computer-Aided Design, ECAD), para simular la PCB facilita la inclusión de requisitos térmicos durante el proceso de diseño. Este trabajo presenta el análisis de alternativas de diseño de la PCB para una fuente de alimentación con el fin de gestionar las temperaturas disipadas en el circuito y reducir el autocalentamiento y el tamaño de la PCB. Los resultados indican que con el análisis propuesto es posible obtener un diseño con mayor rendimiento y confiabilidad.]]></p></abstract>
<abstract abstract-type="short" xml:lang="en"><p><![CDATA[ABSTRACT Printed Circuit Board overheating is a problem that can be present in the power supply section of electronic equipment. Due to the negative impact this problem can have on the performance and reliability of the device, it must receive dedicated attention from the early stages of system design. Using Electronic Computer-Aided Design tools, ECAD, to simulate the PCB facilitates the inclusion of thermal requirements during the design process. This work presents the analysis of PCB design alternatives for a power supply to manage the temperatures dissipated in the circuit, to reduce self-heating and the size of the PCB. Results indicate that with the proposed analysis it is possible to obtain a greater performance and reliability design.]]></p></abstract>
<kwd-group>
<kwd lng="es"><![CDATA[análisis térmico]]></kwd>
<kwd lng="es"><![CDATA[ECAD]]></kwd>
<kwd lng="es"><![CDATA[PCB]]></kwd>
<kwd lng="en"><![CDATA[thermal analysis]]></kwd>
<kwd lng="en"><![CDATA[ECAD]]></kwd>
<kwd lng="en"><![CDATA[PCB]]></kwd>
</kwd-group>
</article-meta>
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<year>2022</year>
<conf-name><![CDATA[ Energy Conversion Congress and Exposition]]></conf-name>
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<collab>Altium</collab>
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